AGC's leading edge AL-X Series, photo curable Low-K dielectric polymer for electronic and wafer level packaging (WLP) meets the most demanding industry requirements. AL-X is a highly cross-linked thermosetting fluorinated polymer exhibiting a unique combination of properties ideally suited for today's packaging needs. AL-X has been specifically designed for wafer level redistribution layers and Integrated Passive Device (IPD) packaging applications.

AGC AL-X Series is very easy to process and can be used with conventional spin-on and UV curing equipment. It has superior adhesion to all layers and provides excellent shape and tolerances to the most severe geometries. Low cure temperature from 180°C to 250°C and high elongation makes AL-X an easy insert into your current manufacturing process.