AGC has reached the pinnicle of fused silica wafers with the development of their Low OH- AQ wafer. The wafer's low hydroxy content, along with its ultra-low impurity levels and thickness availability down to 200µ, makes these wafers a cost-effective carrier for high frequency optical packaging applications.

AGC's low OH- wafers offer a reduction in compaction and high temperature induced creep, thus providing the ultimate stable high frequency or optical substrate.