AGC, Asahi Glass Company, 5290D1 thick film glass paste is formulated for mounting/ sealing MEMS devices to low expansion substrates such as alumina. AGC 5290D1 is formulated with a binder that allows close pitch and width tolerances and burns out cleanly at the peak firing temperature of 425°C producing a smooth void free bond line. AGC 5290D1 bonding glass is typically screen dried and pre-fired to burn out the binder to eliminate the possibility of producing voids within the bond line. Once pre-fired, the surfaces are brought together and fired. In some cases a slight pressure must be applied to the two substrates to insure a complete seal/bond line.

PRINTING:
For screen printing AGC 5290D1, it is recommended that 250 mesh screen be used. Emulsion thickness will vary with desired thickness. It recommended that a starting emulsion thickness of 1 mil be used.

DRYING:
AGC 5290D1 is formulated with a special solvent to allow long screen print life without drastic changes in viscosity but will quickly flash off. Drying should always be done in a well vented oven at between 100~120°C for ten minutes maximum.

THINNING:
AGC 5290D1 is formulated with a blend of solvents specific to promote long screen life and short dry times. It is not recommended that further thinning be done. Please contact the factory representative for further information.

STORAGE:
AGC 5290D1 should be stored in a tightly capped container at room temperature in a dry environment away from direct sunlight.