Ceria Slurry for STI and ILD Applications
Asahi's Ceria-based slurry was developed for oxide layer polishing for STI and ILD applications. Key benefits with CES-350 Series slurries include narrow particle size distribution and superior dispersion technologies for less than 45nm node. These properties enable good slurry stability and superb process control. CES-350 series ceria slurry provides excellent planarization and very low defectivity on customer wafers. All CMP slurry products at Asahi Glass are alpha-tested at Asahi's world-class research center using the latest in semiconductor CMP process equipment.
Product Information
Ceria Slurry Material Data
AGC Ceria Slurry Key Features
  • Single component, Two components
  • Excellent global planarization:
    | Low SiN loss / Low dishing / Good uniformity
  • Low defectivity
  • Excellent stability and long shelf life
Particle Size Distribution of Typical CES Series Ceria Slurry
AGC Ceria Slurry Types for STI Applications
Oxide removal rate as a function of additive content
AGC Ceria Slurry Types for ILD / PMD Applications