Asahi Glass CL-1100, CL-1200, and CL-2100 Series slurries were developed for the most demanding 45nm and 32nm low k/metal multilayer interconnect CMP processes. The CL-2100 Series slurries are designed to reduce dishing and erosion following copper polishing using our CL-1100 and/or CL-1200 Series Cu slurries. The CL Series slurries are designed for optimization of removal rates for TEOS, Ta, TaN, and SiOC layers. Our ability to customize the removal rate ratios of the various layers makes the CL-2100 Series slurry family unique in the industry.